With over 20 years of experience in front-line R&D, business development and team management in the semiconductor field, he has led team to develop and deliver more than 10 ultra-large-scale chips for ADAS, AI, high-performance computing, and wireless and wired communications applications.

He has served as the SVP of Socionext Asia Pacific and the senior management positions of Cadence, Fujitsu and many other well-known multinational semiconductor companies in China and Asia Pacific, and has accomplished business lines breakthrough from zero and growth to billion US dollars in the most difficult situations several times.

With 20 years of experience in semiconductor industry including 10 years in ZTE cable product chips R&D as the chief product engineer of the Microelectronics Research Institute, he has led hundreds of people to deliver more than 10 models in several generations of chip for optical network, data communication and wired terminal application, and won first prize of Shenzhen Science and Technology Progress Award.

He has served as China GM of US ASIC design company eSilicon, with accomplishment of China business YoY 100+% for 7 years, responsible for the delivery and operation of several core chip projects for China top networking system players and AI/Cloud new customers.